Maintenance and repair for wafer processing equipment and effectively work in a team environment and practice good trouble-shooting methods.
• Graduate of EE,ME,ECE or any Technical course.
• Male, 23-28 years old
• At least 1-2 years machine handling experience.
• Should be familiar in dicing saw/back grind discol/die bonder and wire bond
• Must have strong personality and can work well with different people in the organization.