Support customers through analysis of device failures by standard analytical procedures. Find root failure causes and initiate action to determine corrective measures if needed.
Male or Female, 25-35 years old. Graduate ECE, EE, ME or any related Engineering courses. With minimum of one year experience in handling FOL machines (die bond, wire bond) EOL machines (laser mark, dicing & mold). Knowledgeable in SPC and SAS-JMP softwares.